IC Packaging Jobs
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DraperCambridge
necessary for true innovation. For more information about Draper, visit www.draper.com . Job Description Summary: The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced integrated circuit (IC) packaging solutions...
AmazonTempeamazon.jobs
to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI...
7Rays SemiconductorsSan Jose
/ Python / Perl scripting
• Understanding of OCV / AOCV / POCV
• Statistical timing methodologies
• Full-chip signoff methodologies
Preferred Qualifications
• Experience with 2.5D / 3D IC packaging signoff
• Familiarity with TSMC / Samsung / Intel signoff...
Flexcompute Inc.Watertown (MA)workable.com
change materials, and 3D IC packaging.
• Technical Leadership: Act as the primary subject matter expert (SME) for chip cooling, bridging the gap between our internal solver developers and external hardware architects.
• Solution Architecting: Work...
Waltham (MA)panasonic.com
materials for the Panasonic Industry Electronic Materials Division, including circuit board laminates and IC packaging materials.
• Conduct hands-on laboratory research in core and adjacent electronic materials, including sustainable
materials, soft circuit...
BIOTRONIK SE & Co. KGLake Oswegoconnecticum.de
bond, encapsulation, and chip attach; their materials and processes. Detailed knowledge of IC packaging failure modes and root cause analysis techniques Experience in high reliability electronics manufacturing environment Experience with quality systems...
QualcommAustin
design/layout flow.
• Utilizes tools/applications (e.g., RTL to GDS Flow, Virtuoso) to execute and enable architecture and design of an individual block/SoC or IC Package.
• Writes detailed technical documentation for EDA/IP/ASIC projects.
Level...
Lincoln (RI)tiptopjob.com
and reliability systems and practices.
• Experience working with PLM systems such as Omnify, Agile or Matrix One is a plus.
• Ability to drive projects to completion while working as part of a cross functional team.
• Familiarity with IC packaging...
QualcommSan Diego
and design of a specific part of a block/SoC or IC Package.
• Writes technical documentation for EDA/IP/ASIC projects.
Level of Responsibility:
• Works under supervision.
• Decision-making affects direct area of work and/or work group...
Calabasaskeysight.com
principles, Signal Integrity, RF/Microwave theory, and high frequency circuit design methodologies
• Minimum 7+ years of experience (MS and 5 years) in hardware/circuit and IC package design, high-frequency modeling/optimization, or high-power density design...
QualcommSan Diego
design/layout flow.
• Utilizes tools/applications (e.g., RTL to GDS Flow, Virtuoso) to execute and enable architecture and design of an individual block/SoC or IC Package.
• Writes detailed technical documentation for EDA/IP/ASIC projects.
Level...
BIOTRONIK SE & Co. KGLake Oswegoconnecticum.de
in microelectronics, advanced packaging, semiconductors, or related disciplines. Experience developing medical devices or other high‑reliability electronics, including PCBA, electronic assembly/IC packaging, and component‑level technologies.
Proven ability to plan...
AmazonTempeamazon.jobs
of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will own the package layout from initial floor planning through tape out and manufacturing release. You'll drive the physical implementation of complex multi...
Irvinetiptopjob.com
are changing the way the world communicates.
Requisition ID:77803
Description
In this role, candidate will manage and execute IC Packaging Process development, working with internal design, manufacturing and reliability teams and external material...
Colorado Springskeysight.com
into subsystem requirements, top-level specifications, interface definitions, and validation plans that align cross-functional development teams.
• Drive cross-functional technical alignment across system, IC, package, PCB, firmware, software, test, reliability...
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