Senior Packaging Engineer with Security Clearance
Zachary Piper Solutions, LLC La Canada Flintridge
Piper Companies is looking for an Senior Packaging Engineer to join a cutting
-edge startup developing advanced hardware and system technologies that eliminate bottlenecks in large-scale AI computing.The ideal Senior Packaging Engineer will lead advanced component and system-level packaging efforts, with a strong emphasis on pcb assembly and organic substrate technologies on site in Saratoga, CA.
Responsibilities for the Senior Packaging Engineer:- Lead packaging development for single-chip (flip-chip) and multi-component module assemblies
- Drive system integration for full module builds (wafer + cold plate + multi-chip packages)
- Collaborate directly with Taiwan subcontractors and OSAT partners on assembly, manufacturing, yield, and module-level improvements
- Support substrate technology development and work closely with internal and external teams to refine organic substrate design and production Qualifications for the Senior Packaging Engineer:
- 10+ years of experience as an advanced packaging engineer, module integration engineer, or similar role
- Must be eligible to work in the United States and obtain and maintain an Active U.S.
- Strong background in organic substrate technology
- Experience with CoWoS, 2.5D packaging, and system-on-wafer programs involving TSMC
- Hands-on experience working with OSATs and Taiwan subcontractor engagement
- Understanding of multi-layer substrate concepts and module yield improvement strategies
- Bachelor's, Master's, or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, or related field Compensation/Benefits for the Senior Packaging Engineer:
- Salary/Rate Range: $210,000
- $265,000 plus stock depending on experience
- Comprehensive Benefits: Medical, Dental, Vision, 401K, PTO, Sick Leave (as required by law), and Holidays This job opens for applications on 5/6/2026.
Keywords: advanced packaging, flip-chip, multi-chip module, MCM, organic substrate, CoWoS, 2.5D, 3D packaging, TSMC system-on-wafer, OSAT, Wistron, module integration, cold plate integration, wafer-level assembly, substrate technology, semiconductor packaging, high-density interconnect, HDI substrates, yield improvement, semiconductor manufacturing, module engineering #LI-BR1 #LI-ON SITE
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